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Chip Cleaning

    After its removal, the memory chip is cleaned to remove any excess epoxy or bridging of contact points. This residue must be removed using a soldering iron and wick and/or with a cleaning solvent. This must be done carefully as not to add further stress to the chip while ensuring all residue is removed. The memory chip may require re-balling. Memory chips have many tiny balls on one side that can become detached in the chip-off process. In these cases, the examiner must re-ball the chip either manually or with the help of specialized tools. More information on the reballing process can be found here.

A chip with damaged balls and excess residue

Soldering iron

Soldering wick

Created by Mary Braden Murphy

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