Chip-Off Forensics

The first step is to analyze the state of the mobile device. Chip-off forensics is typically used on heavily damaged mobile phones. For the purposes of this project, the mobile devices tested were not be intentionally damaged, however; some of the devices donated to the project were damaged.

Device teardown involves physically taking apart the mobile phone to reveal only the printed circuit board (PCB) and identifying the key components. To do so, online resources that have teardown guides can be consulted to understand how to completely take apart each make and model of phone. Components such as cameras, keyboards, LED displays, and plastic frames must be removed. Additionally, items such as tape and stickers should also be removed as they can cover up text on the PCB and should not be exposed to the heat involved in chip-off. Note the variety of shapes, sizes, and components within the devices below.